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Ingot°íÁ¤¿ë(¹ÝµµÃ¼,ž籤,LED) Á¢ÂøÁ¦
Chip hacking ¹æÁö¿ë glue
01.
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Wafer Á¦Á¶ ½Ã Ingot ¹× Ingot °íÁ¤¿ë beamÀ» È¿°úÀûÀ¸·Î Á¢Âø½ÃŰ´Â ¿ëµµ·Î »ç¿ëµÇ¸ç, IngotÀ» °³º° wafer·Î Àý´ÜÇÑ ÈÄ¿¡´Â ¿Â¼ö¿¡¼­ ½±°Ô ¶³¾îÁú ¼ö ÀÖµµ·Ï ¼³°èµÈ Á¦Ç°ÀÔ´Ï´Ù.
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- Red or Green paste
Áֿ伺ºÐ
- Epoxy, Hybrid resin, Silica
Æ÷Àå
- 0.8, 1.0kg(bottle)
ÁÖ¿äÆ¯¼º
1. Excellent demounting property
2. Good adhesion
3. Extended pot life
4. Good workability
 
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* ¹ÝµµÃ¼ Wafer ¿ë
±¸ºÐ Trubond S302-J Trubond S500-J Trubond S351-J
(A) (B) (A) (B) (A) (B)
Àû ¿ë Ingot bonding Ingot beam bonding Ingot beam bonding
¿Ü °ü Red Light brown Green Yellow white Black Light brown
È¥ÇÕ ºñÀ² 2 1 1 1 1 1
Á¡µµ(cPs) 20,000 16,000 50,000 60,000 70,00 40,000
TI 2.0 5.0 1.4 1.5 2.4 4.5
¹Ú¸® Á¶°Ç 70~90¡É Water 260¡É Hot plate 260¡É Hot plate
* ž籤 Wafer¿ë
±¸ºÐ Trubond AH6302 Trubond AH6500
(A) (B) (A) (B)
Àû ¿ë Ingot bonding Ingot beam bonding
¿Ü °ü Red Light brown Green Yellow white
È¥ÇÕ ºñÀ² 2 1 1 1
Á¡µµ(cPs) 20,000 16,000 50,000 60,000
TI 2.0 5.0 1.4 1.5
¹Ú¸® Á¶°Ç 70~90¡É Water 260¡É Hot plate