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HOME > »ç¾÷ºÐ¾ß > ¼ÒÀç |
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Ingot°íÁ¤¿ë(¹ÝµµÃ¼,ž籤,LED) Á¢ÂøÁ¦ |
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01. |
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Á¦Ç° °³¿ä |
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Wafer Á¦Á¶ ½Ã Ingot ¹× Ingot °íÁ¤¿ë beamÀ»
È¿°úÀûÀ¸·Î Á¢Âø½ÃŰ´Â ¿ëµµ·Î »ç¿ëµÇ¸ç,
IngotÀ» °³º° wafer·Î Àý´ÜÇÑ ÈÄ¿¡´Â ¿Â¼ö¿¡¼
½±°Ô ¶³¾îÁú ¼ö ÀÖµµ·Ï ¼³°èµÈ Á¦Ç°ÀÔ´Ï´Ù. |
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¼º»ó |
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- Red or Green paste |
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Áֿ伺ºÐ |
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- Epoxy, Hybrid resin, Silica |
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Æ÷Àå |
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- 0.8, 1.0kg(bottle) |
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ÁÖ¿äÆ¯¼º |
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1. Excellent demounting property
2. Good adhesion
3. Extended pot life
4. Good workability |
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Á¦Ç°Á¤º¸ |
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* ¹ÝµµÃ¼ Wafer ¿ë |
±¸ºÐ |
Trubond S302-J |
Trubond S500-J |
Trubond S351-J |
(A) |
(B) |
(A) |
(B) |
(A) |
(B) |
Àû ¿ë |
Ingot bonding |
Ingot beam bonding |
Ingot beam bonding |
¿Ü °ü |
Red |
Light brown |
Green |
Yellow white |
Black |
Light brown |
È¥ÇÕ ºñÀ² |
2 |
1 |
1 |
1 |
1 |
1 |
Á¡µµ(cPs) |
20,000 |
16,000 |
50,000 |
60,000 |
70,00
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40,000
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TI |
2.0 |
5.0 |
1.4 |
1.5 |
2.4 |
4.5 |
¹Ú¸® Á¶°Ç |
70~90¡É Water |
260¡É Hot plate |
260¡É Hot plate |
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±¸ºÐ |
Trubond AH6302 |
Trubond AH6500 |
(A) |
(B) |
(A) |
(B) |
Àû ¿ë |
Ingot bonding |
Ingot beam bonding |
¿Ü °ü |
Red |
Light brown |
Green |
Yellow white |
È¥ÇÕ ºñÀ² |
2 |
1 |
1 |
1 |
Á¡µµ(cPs) |
20,000 |
16,000 |
50,000 |
60,000 |
TI |
2.0 |
5.0 |
1.4 |
1.5 |
¹Ú¸® Á¶°Ç |
70~90¡É Water |
260¡É Hot plate |
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