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BOC(Board on Chip) Package¿ë
Metal Lead Frame¿ë
Plastic Package¿ë
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Die¸¦ Metal lead frameÀ§¿¡ °íÁ¤½Ã۱â À§ÇÑ Àüµµ¼º ÀϾ×Çü Á¢ÂøÁ¦·Î 260¡É reflow¿Âµµ¿¡¼­ Á¢Âø·Â ¼Õ½Ç ¾øÀÌ Áö¼ÓÀûÀ¸·Î ¼º´ÉÀ» À¯ÁöÇÒ ¼ö ÀÖ´Â ¿ì¼öÇÑ Ç°Áú°ú JEDEC level¿¡ ºÎÇÕÇÏ´Â °í½Å·Ú¼ºÀ» °®°í ÀÖ½À´Ï´Ù
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- Gray color paste
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- Epoxy, Hybrid resin, Silver
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- 5cc. 10cc, 30cc (syringe)
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- Low moisture absorption
- Minimum resin bleed out
- Excellent adhesion
- Improved JEDEC performance
- Good workability
Package ´Ü¸éµµ ¹× Àû¿ëºÎÀ§
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Á¦Ç°¸í °æÈ­Á¶°Ç Á¡µµ(cPs @ 5rpm) TI Tg (¡É) ¿­Àüµµµµ(mW/K) Àû¿ë
Trubond A501 175¡É / 15min 10,000 4.5 42 1.2 TSOP, QFP
Trubond A505 175¡É / 15min 11,500 5.0 36 1.34 SOP. SOIC, TSOP
Trubond A506 175¡É / 30min 8,000 5.8 45 2.8 QFN, QFP
Trubond AP4200 175¡É / 15min 10,000 5.3 80 2.1 QFN, QFP
Trubond AP2500 175¡É / 15min
or
200¡É / 70sec
8,000 5.4 52 1.2 TSOP, QFN
Trutherm A853 175¡É / 30min 12,000 5.3 80 20 High thermal package