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BOC(Board on Chip) Package¿ë
Metal Lead Frame¿ë
Plastic Package¿ë
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- White, Red or Gray paste
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- Epoxy, Hybrid resin, Silver, Silica
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- 5cc. 10cc, 30cc (syringe)
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- Low moisture absorption
- Minimum resin bleed out
- Excellent adhesion
- Improved JEDEC performance
- Good dispensibility
 
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PBGA
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Á¦Ç°¸í °æÈ­Á¶°Ç Á¡µµ(cPs @ 5rpm) TI Tg (¡É) ¿­Àüµµµµ(mW/K) Àû¿ë ºñ°í
Trubond CB602 175¡É/ 15min 10,000 5.2 38 1.2 PBGA Electrically conductive type
Trubond AP4700 175¡É/ 15min 10,500 4.7 54 1.3 PBGA, FBGA Electrically conductive type