HOME > »ç¾÷ºÐ¾ß > ¼ÒÀç
BOC(Board on Chip) Package¿ë
Metal Lead Frame¿ë
Plastic Package¿ë
Underfill Á¢ÂøÁ¦
04.
Á¦Ç° °³¿ä
Bump¿Í Die¸¦ ±â°èÀû ¼Õ»ó ¹× ºÎ½ÄÀ¸·ÎºÎÅÍ º¸È£ÇÔ°ú µ¿½Ã¿¡ package ½Å·Ú¼ºÀ» ÃæºÐÈ÷ È®º¸ÇÒ ¼ö ÀÖµµ·Ï ¼³°èµÇ¾ú½À´Ï´Ù. ¶ÇÇÑ TRUFILL underfill Á¦Ç°±ºÀº ¶ÇÇÑ ¹«¿¬ assembly¿¡¼­ ¿ä±¸ÇÏ´Â °í¿Â°øÁ¤¿¡ »ç¿ëµÉ ¼ö ÀÖ½À´Ï´Ù.
¼º»ó
- White or Black paste
Áֿ伺ºÐ
- Epoxy, Hybrid·¹Áø, Silica
Æ÷Àå
- 30cc, 50cc (syringe)
ÁÖ¿äÆ¯¼º
- Low stress cure
- Improved resistance to thermal shock and solder reflow
- Low alpha particle filler
- Extended pot life
- Fast cure
- Superior moisture resistance
- Anti-cracking
 
Package ´Ü¸éµµ ¹× Àû¿ëºÎÀ§
fcBGA
Á¦Ç°Á¤º¸
Á¦Ç°¸í °æÈ­Á¶°Ç Á¡µµ(cPs @ 5rpm) TI Àû¿ë
Trufill CF3300 150¡É / 2hr 60,000 1.2 fcBGA
Trufill UF4300 150¡É / 2hr 500 1.1 COF
Trufill UF5300 150¡É / 2hr 2,000 1.1 TCP