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HOME > 事业领域 > 新材料(制造领域) |
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铸块(Ingot)固定用(半导体，太阳光，LED)胶粘剂 |
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槪要 |
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| 本产品用于制造晶圆(Wafer)时有效粘着铸块及铸块固定用beam，并设计将铸块切断为个别晶圆后在温水可以容易掉下。 |
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性状 |
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| - 红色或绿色paste |
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主要成分 |
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| - 环氧树脂，杂化树脂，二氧化硅 |
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包装 |
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| - 0.8kg, 1.0kg(bottle) |
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主要特点 |
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- Excellent demounting property
- Good adhesion
- Extended pot life
- Good workability |
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产品信息 |
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| * 半导体晶圆用 |
| 区分 |
Trubond S302-J |
Trubond S500-J |
Trubond S351-J |
| (A) |
(B) |
(A) |
(B) |
(A) |
(B) |
| 适用 |
Ingot bonding |
Ingot beam bonding |
Ingot beam bonding |
| 外管 |
Red |
Light brown |
Green |
Yellow white |
Black |
Light brown |
| 混合比率 |
2 |
1 |
1 |
1 |
1 |
1 |
| 粘度 |
20,000 |
16,000 |
50,000 |
60,000 |
70,000 |
40,000 |
| TI |
2.0 |
5.0 |
1.4 |
1.5 |
2.4 |
4.5 |
| 剥离条件 |
70℃~90℃ Water |
260℃ Hot plate |
260℃ Hot plate |
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| 区分 |
Trubond AH6302 |
Trubond AH6500 |
| (A) |
(B) |
(A) |
(B) |
| 适用 |
Ingot bonding |
Ingot beam bonding |
| 外管 |
Red |
Light brown |
Green |
Yellow white |
| 混合比率 |
2 |
1 |
1 |
1 |
| 粘度 |
20,000 |
16,000 |
50,000 |
60,000 |
| TI |
2.0 |
5.0 |
1.4 |
1.5 |
| 剥离条件 |
70℃~90℃ Water |
260℃ Hot plate |
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