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HOME > 事业领域 > 新材料(制造领域) |
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Metal Lead Frame用 |
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| 02. |
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槪要 |
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| 在把芯片固定在金属引线架上的传导性溢液型胶粘剂的260℃回流温度中，具备能够使胶粘剂无损失的持续保持性能的优秀品质和符合固态技术协会标准的高信赖性. |
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性状 |
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| - 灰色paste |
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主要成分 |
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| - 环氧树脂, 杂化树脂(hybrid resin)，银 |
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包装 |
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| - 5cc, 10cc, 30cc (syringe) |
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产品特点 |
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- Low moisture absorption
- Minimum resin bleed out
- Excellent adhesion
- Improved JEDEC performance
- Good workability |
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封装剖视图及适用位置 |
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产品详细信息 |
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| 产品名称 |
硬化条件 |
粘度(cPs @ 5rpm) |
TI |
Tg (℃) |
热导率(mW/K) |
适用 |
| Trubond A501 |
175℃ / 15min |
10,000 |
4.5 |
42 |
1.2 |
TSOP, QFP |
| Trubond A505 |
175℃ / 15min |
11,500 |
5.0 |
36 |
1.34 |
SOP, SOIC, TSOP |
| Trubond A506 |
175℃ / 30min |
8,000 |
5.8 |
45 |
2.8 |
QFN, QFP |
| Trubond AP4200 |
175℃ / 15min |
10,000 |
5.3 |
80 |
2.1 |
QFN, QFP |
| Trubond AP2500 |
175℃ / 15min
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200℃ / 70sec |
8,000 |
5.4 |
52 |
1.2 |
TSOP, QFN |
| Trutherm A853 |
175℃ / 30min |
12,000 |
5.3 |
80 |
20 |
High thermal package |
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